STEP 23. Now using a vacuum cleaner or compressed air blower get rid of all dust build up in the case and on all component parts of the ps3 (pay special attention to the fan assembly and heat sink fins(MUST BE CLEAR OF DUST).

STEP 24. Typical example of dust build up. See below.

Heat sink plates before heat sink compound removed (dusty).

STEP 25. Once cleaned you should now have a nice pile of bits that looks something like this, see below.

Now for the tricky bit!

STEP 26. Check the top metal cover plate (underside) for burn-in marks, as you can see below this ps3 got very hot before it yloded!

STEP 27. Place the ps3 mother board on a flat heat resistive surface (kitchen work top or melamine shelf will be fine).

STEP 28. Turn heat gun on and set temperature to 350 deg and the fan speed to low (to high and it will move the surface mount bits).
Allow gun to get up to temperature before continuing!!!!

STEP 29. Using a circular motion hold heat gun over areas outlined below (keep heat gun an inch above board/components at all times).

STEP 30. CPU side first.

STEP 31. After 15 to 20 seconds move onto the next area.

STEP 32. Once all marked areas have been heated/reflowed on the mother board LEAVE for at least 10 to 15 minutes to cool.
(DO NOT MOVE MOTHER BOARD WHILE COOLING).

STEP 33. A popping noise may be heard during cooling, don’t worry this is normal.

STEP 34. NON CPU side.

STEP 35. After 10 to 15 seconds move onto the next area.

STEP 36. Once all marked areas have been heated/reflowed on the mother board LEAVE for at least 10 to 15 minutes to cool.
(DO NOT MOVE MOTHER BOARD WHILE COOLING).

STEP 37. A popping noise may be heard during cooling don’t worry this is normal.

Heat sink compound still on in this picture, remove before reflowing.

Heat sink rubber pads still on in this picture remove before reflowing also hold ribbons out of way while reflowing.

Congratulations, You have just repaired you’re yloded ps3 mother board.

STEP 38. Now its time to apply new heat sink compound [video] to the 2 processors, when doing this its always best to follow the manufacturers instructions but I believe the process is the same with all types (please check instructions that come with paste), before continuing

STEP 39. The paste I am using is called AKASA 450 it’s a silver based compound with a thermal conductivity of 9.24w/m deg c and an operating range of 0 to 200 deg c. You can buy it from most pc shops but I get mine from my local Maplin ( I have been told that there is a better compound on the market called arctic silver but I haven’t tried it as yet so the choice is yours).

STEP 40. Use syringe supplied and dispense a small worm of compound from top to bottom on the left hand side of processor chip, now using credit card supplied spread compound evenly and thinly over processor face (to much is bad and not enough is also bad) the ideal amount is
when you can almost see through the paste.

STEP 41. Now repeat on the other processor.

STEP 42. See below.